with multidisciplinary teams to advance concepts from device design through system demonstration and application validation.

Duties and Responsibilities include:

• Drive the end-to-end lifecycle of hybrid III-V/silicon photonic integrated circuits (PICs), including definition, architectural design, simulation, layout, and comprehensive characterization.
• Conduct high-frequency and active device characterization, performing RF testing beyond 50 GHz, standard laser LIV measurements, optical injection locking, Bit Error Rate (BER) testing, and eye-diagram analysis.
• Guide and mentor a multidisciplinary team of Ph.D., Master's, and undergraduate student researchers, fostering technical growth and aligning their work with project milestones.
• Author, review, and present high-impact manuscripts and technical papers for publication in top-tier peer-reviewed journals and international academic conferences.
• Partner with internal and external multidisciplinary teams to transition novel photonic concepts into validated hardware prototypes and system demonstrations.

Departmental Required Skills

• Ph.D. in Electrical Engineering, Photonics, Physics, or a closely related engineering discipline.
• Deep technical understanding of photonic integrated circuits (PICs) and components, including lasers, modulators, amplifiers, detectors, passives, and optical coupling.
• Proven experience in PIC simulation, design, and layout using industry-standard tools (e.g., Lumerical, Tidy3D, IPKISS, KLayout, Cadence, or GDSFactory).
• Extensive laboratory experience with PIC characterization across O-O, O-E, and E-O configurations, alongside high-speed RF electro-optical testing.
• Familiarity with die- or wafer-level probing of both active and passive PIC devices.
• Demonstrated track record in the design, fabrication, and physical characterization of photonic devices and systems.
• Strong written and verbal English communication skills, with a proven ability to work effectively within multidisciplinary teams.