About the Project
Integrating photonic integrated circuits (PICs) with miniature free-space optical elements is crucial for creating next-generation functional optoelectronic modules that can reliably operate in real-world conditions. Achieving precise alignment and robust bonding of tiny components like fast axis collimators (FACs) and fibre array units (FAUs) to the PIC requires sub-micron positional accuracy, presenting significant technical challenges. However, mastering this capability will unlock the…
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