Rate My Professor Mark Poliks

Poliks' research interests include electronic materials, electronics packaging, flexible electronics and roll-to-roll manufacturing, additive manufacturing, and sensory systems, with emphasis on high-performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, materials processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control, and reliability. His work has developed new approaches for fabrication of sensors, thin-film transistors, and RF devices on flexible plastic or glass, interconnect strategies for thinned integrated circuits in flexible hybrid electronics for wearable healthcare or industrial monitoring systems, and methods to print circuits and components onto flexible and complex surfaces. He has received more than $20 million in research funding from federal, New York state, and corporate sources and more than $30 million in equipment funding from federal and state sources. Poliks is the recipient of the SUNY Chancellor’s Award for Excellence in Research and was named a 2017 NextFlex Fellow. He has authored more than 100 technical papers, holds 48 U.S. patents, leads the New York State Node of the DoD NextFlex Manufacturing USA, serves on technical councils for FlexTech Alliance, NBMC, and NextFlex including the NextFlex Governing Council, and chaired the 69th IEEE Electronics Packaging Society Electronic Component and Technology Conference.