
Always goes the extra mile for students.
Mark D. Poliks is a SUNY Distinguished Professor, Professor of Empire Innovation, Professor of Systems Science and Industrial Engineering, Professor of Materials Science and Engineering, Undergraduate Director, and Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at Binghamton University, State University of New York. CAMM, a New York State Center of Advanced Technology that he established in 2006, explores roll-to-roll processing methods, including large-area photolithography, for flexible electronics and displays, with equipment funding from the U.S. Display Consortium and the Army Research Lab. Poliks holds dual undergraduate degrees with honors in chemistry and mathematics from the University of Massachusetts, a PhD in materials science and engineering from the University of Connecticut, and completed a McDonnell-Douglas postdoctoral fellowship in solid-state magnetic resonance at Washington University in St. Louis. Prior to his academic career, he held senior technical management positions at IBM Microelectronics and Endicott Interconnect.
Poliks' research interests include electronic materials, electronics packaging, flexible electronics and roll-to-roll manufacturing, additive manufacturing, and sensory systems, with emphasis on high-performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, materials processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control, and reliability. His work has developed new approaches for fabrication of sensors, thin-film transistors, and RF devices on flexible plastic or glass, interconnect strategies for thinned integrated circuits in flexible hybrid electronics for wearable healthcare or industrial monitoring systems, and methods to print circuits and components onto flexible and complex surfaces. He has received more than $20 million in research funding from federal, New York state, and corporate sources and more than $30 million in equipment funding from federal and state sources. Poliks is the recipient of the SUNY Chancellor’s Award for Excellence in Research and was named a 2017 NextFlex Fellow. He has authored more than 100 technical papers, holds 48 U.S. patents, leads the New York State Node of the DoD NextFlex Manufacturing USA, serves on technical councils for FlexTech Alliance, NBMC, and NextFlex including the NextFlex Governing Council, and chaired the 69th IEEE Electronics Packaging Society Electronic Component and Technology Conference.
